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TDA8939
Zero dead time Class-D 7.5 A power comparator
Rev. 01 -- 22 April 2004 Objective data sheet
1. General description
Zero dead time Class-D 7.5 A power comparator The TDA8939 is a power comparator designed for use in a high efficiency class-D audio power amplifier system. It contains power switches, drive logic, protection circuitry, bias circuitry and a fully differential input stage (comparator). This device is optimized for applications in fully digital open-loop class-D audio systems (in combination with a digital PWM controller). The TDA8939 power comparator operates with high efficiency and low dissipation. The system operates over a wide supply voltage range from 10 V up to 30 V.
2. Features
s s s s s s s s s Zero dead time switching Maximum output current 7.5 A Standby mode High efficiency Operating voltage from 10 V to 30 V (symmetrical) or 20 V to 60 V (asymmetrical) Low quiescent current High output power Diagnostic output Thermal protection, current protection and voltage protection.
3. Applications
s s s s s Television sets Home-sound sets Multimedia systems All mains fed audio systems Car audio (boosters).
Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
4. Quick reference data
Table 1: Quick reference data VP = 25 V; fcarrier = 384 kHz. Symbol VP Parameter supply voltage Conditions symmetrical supply voltage asymmetrical supply voltage Iq(tot) total quiescent current no load connected; no filters; no snubbers connected efficiency Prated
[1]
Min 10 20 -
Typ 25 50 50
Max 30 60 70
Unit V V mA
[1]
-
90
-
%
When the supply voltage is below 12.5 V the PWM outputs will not be able to switch to the high side at the first PWM cycle.
5. Ordering information
Table 2: Type number TDA8939TH Ordering information Package Name Description Version SOT566-3 HSOP24 plastic, heatsink small outline package; 24 leads; low stand-off height
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Objective data sheet
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
6. Block diagram
22
BOOT1 VDDP1
TDA8939TH
VDDA1 IN1P IN1N VSSA1 3 4 2 1 ZERO DEAD TIME CONTROL DRIVER LOW DRIVER HIGH
23
21
OUT1
POWERUP
5
STAB 12 V
19 20 OTP OCP OVP UVP temperature sensor current protection overvoltage protection undervoltage protection 15 14
STAB1 VSSP1
DIAGN
7
Q
PROTECTION LATCH
S R
ENABLE CGND
6 8
BOOT2 VDDP2
VDDA2 IN2P IN2N VSSA2
10 9 11 12 ZERO DEAD TIME CONTROL
DRIVER HIGH
16
OUT2
DRIVER LOW
STAB 12 V
18 17
STAB2 VSSP2
24
sub
13
001aaa624
VSSD
heatsink
n.c.
Fig 1. Block diagram.
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Objective data sheet
Rev. 01 -- 22 April 2004
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
7. Pinning information
7.1 Pinning
VSSD 24 VDDP1 23 BOOT1 22 OUT1 21 VSSP1 20 STAB1 19 STAB2 18 VSSP2 17 OUT2 16 BOOT2 15 VDDP2 14 n.c. 13
001aaa625
1 2 3 4 5
VSSA1 IN1N VDDA1 IN1P POWERUP ENABLE DIAGN CGND IN2P
TDA8939
6 7 8 9
10 VDDA2 11 IN2N 12 VSSA2
Fig 2. Pin configuration.
7.2 Pin description
Table 3: Symbol VSSA1 IN1N VDDA1 IN1P POWERUP ENABLE DIAGN CGND IN2P VDDA2 IN2N VSSA2 n.c. VDDP2 BOOT2 OUT2 VSSP2 STAB2 Pin description Pin 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Description negative analog supply voltage for channel 1 inverting input channel 1 positive analog supply voltage for channel 1 non-inverting input channel 1 enable input for switching on internal reference sources digital enable input digital open-drain diagnostic output for OTP, OCP, OVP and UVP (active LOW) common ground, reference ground for diagnostic, enable and power-up non-inverting input channel 2 positive analog supply voltage for channel 2 inverting input channel 2 negative analog supply voltage for channel 2 not connected positive power supply voltage for channel 2 bootstrap capacitor 2 PWM output channel 2 negative power supply voltage for channel 2 decoupling internal stabilizer for logic supply channel 2
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Objective data sheet
Rev. 01 -- 22 April 2004
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
Pin description ...continued Pin 19 20 21 22 23 24 Description decoupling internal stabilizer for logic supply channel 1 negative power supply voltage for channel 1 PWM output channel 1 bootstrap capacitor 1 positive power supply voltage for channel 1 negative digital supply voltage heat spreader of package; internally connected to VSSD
Table 3: Symbol STAB1 VSSP1 OUT1 BOOT1 VDDP1 VSSD SUB
8. Functional description
8.1 General
The TDA8939 class-D power comparator is designed for use in fully digital open-loop class-D audio applications. Excellent timing accuracy with respect to delay times and rise and fall times is achieved and one of the most important sources of distortion in a full digital open-loop audio amplifier is eliminated; the zero dead time switching concept is included. The TDA8939 contains two independent class-D output stages with high power D-MOS switches, drivers, timing and control logic. For protection a temperature sensor, a maximum current detection and overvoltage detection circuit are integrated. An internal protection latch keeps the power comparator in shut-down mode after a fault condition has been detected. External reset of the latch is required via the enable input.
8.2 Protections
Overtemperature, overcurrent and overvoltage sensors are included in the TDA8939 power comparator. In the event that the maximum temperature, maximum current or maximum supply voltage is exceeded the diagnostic output is activated (open-drain output pulled-down via external pull-up resistor). The diagnostic output pin is activated (active LOW) in case of: 1. Overtemperature (OTP): the junction temperature (Tj) exceeds a threshold level. 2. Overcurrent (OCP): the output current exceeds the maximum output current threshold level (e.g. when the loudspeaker terminals are short-circuited it will be detected by the current protection). 3. Overvoltage (OVP): the supply voltage applied to the power comparator exceeds the maximum supply voltage threshold level. The TDA8939 is self-protecting. If a fault condition (OTP, OCP or OVP) is detected it will pull-down the diagnostic output (pin 7), while at the same time shutting down the power stage. In case of a fault condition in one of the half-bridges or output channel the other half-bridge and output channel will also shut down. All protections trigger a latch which ensures that the power stage remains deactivated until the latch is reset again. The latch is reset by switching the enable voltage of the power stage to LOW level. Both set (S) and reset (R) inputs of the protection latch trigger on a negative falling slope.
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Objective data sheet
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
The block diagram of diagnostic output including OTP, OCP and OVP is illustrated in Figure 3. The diagnostic output (pin 7) is an open-drain output; a pull-up resistor connected to +Vpull-up has to be applied externally.
+Vint OTP
R1
TDA8939
disable power stage +Vpull-up
OCP
R2 C1
S LATCH R enable CGND
001aaa623
Rpu
open-drain Q DIAGN
OVP
Fig 3. OCP, OTP and OVP protection: S/R latch.
8.3 Interfacing between controller and the TDA8939
For interfacing with a digital PWM controller IC or microcontroller in the final system application the following inputs and outputs are available see Table 4 and 5.
8.3.1 Inputs
Table 4: Pin name IN1P and IN1N IN2P and IN2N POWERUP Inputs Pin number 4 and 2 9 and 11 5 Description full differential input for output channel 1; referenced with respect to each other; common mode referenced to VSSD full differential input for output channel 2; referenced with respect to each other; common mode referenced to VSSD standby switch; reference to CGND; at a LOW level the device is in standby mode and consumes a very low standby current. At HIGH level the device is DC-biased (switch-on of internal reference voltages and currents). The device can only be switched to full operating mode by the enable input, if the power-up input is at HIGH level. mode switch; reference to CGND; at a LOW level the power D-MOS switches are open and the PWM output is floating; all internal logic circuits are in reset condition. At a HIGH level the power comparator is fully operational if the power-up input is also at a HIGH level. In this condition the power comparator outputs are controlled by the input pins (IN1P, IN1N, IN2P and IN2N); see also Figure 6. The enable input signal is also used to reset the protection latch.
ENABLE
6
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Objective data sheet
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TDA8939
Zero dead time Class-D 7.5 A power comparator
8.3.2 Outputs
Table 5: Pin name DIAGN Outputs Pin number 7 Description Digital open-drain output; referenced to CGND; output indicates the following fault conditions: OTP, OCP, OVP and UVP. In the event of a fault condition the output is pulled to the CGND voltage (active LOW). If the diagnostic output functionality is used in the application, an external pull-up resistor is required.
8.3.3 Reference voltages
Table 6: Pin name CGND VSSD Reference voltages Pin number 8 24 Description common ground; reference ground for diagnostic output, enable input and power-up input negative digital supply; reference ground digital circuits. The VSSD pin should be connected to VSS voltage in the application. Internally the VSSD pin is connected to the VSSAx and VSSPx (e.g. VSSA1 and VSSP1) via an ESD protection diode.
8.4
Start-up timing
Power comparator mode selection:
* Standby mode: when pin POWERUP is LOW, the power comparator is in standby
mode, independent of the signal on the enable input
* Reset mode: when pin POWERUP is HIGH, the status of the power comparator is
controlled by pin ENABLE; if pin ENABLE is LOW, the status of the power stage is reset and the outputs are floating
* Operating mode: when pin ENABLE is HIGH, the power stage is in operating mode.
To ensure correct start-up of the power stage, the enable input should never be HIGH when the power-up input is LOW. Before switching to operating mode, the amplifier should first be switched to reset mode. Remark: It is possible to directly connect the power-up input to the positive supply line (e.g. VDDA1). As soon as the supply voltage is applied the device will be DC-biased (reset mode).
Table 7: Pin POWERUP LOW HIGH HIGH ENABLE X LOW HIGH standby reset operating Mode selection Mode
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Objective data sheet
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
ENABLE
POWERUP
status
standby
reset
operating
reset
standby
start-up sequence
switch-off sequence
001aaa062
Fig 4. Mode selection timing diagram.
9. Limiting values
Table 8: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Vp IORM Tstg Tamb Tvj Parameter supply voltage repetitive peak current on output pins storage temperature ambient temperature virtual junction temperature Conditions Min -55 -40 Max 60 7.5 +150 +85 150 Unit V A C C C
10. Thermal characteristics
Table 9: Symbol Rth(j-a) Rth(j-c) Thermal characteristics Parameter thermal resistance from junction to case Conditions Value 40 1.3 Unit K/W K/W thermal resistance from junction to ambient in free air
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
11. Static characteristics
Table 10: Static characteristics VP = 25 V; fcarrier = 384 kHz; Tamb = 25 C; unless otherwise specified. Symbol Supplies VP Iq supply voltage quiescent current symmetrical supply voltage asymmetrical supply voltage no load; no filters; no snubbers connected reset mode Istb VSTAB1, VSTAB2 Vi(diff) Vi(com) Ii(bias) VCGND standby current stabilizer output voltage standby mode Internal stabilizer logic supplies 11 12 15 V
[1]
Parameter
Conditions
Min 10 20 -
Typ 25 50 50 10 120
Max 30 60 70 20 170
Unit V V mA mA A
Comparator full differential input stage: pins IN1P, IN1N, IN2P and IN2N differential input voltage range common mode input voltage input bias current common ground reference voltage LOW-level output voltage maximum pull-up voltage leakage current LOW-level input voltage HIGH-level input voltage input current LOW-level input voltage HIGH-level input voltage hysteresis voltage input current VPOWERUP = 12 V asymmetrical supply 1 VSSA1 3.3 0 12 10 V A V VDDA1 - 7.5 V
Common ground: pin CGND
Diagnostic output: pin DIAGN VOL Vpu(max) IL VIL VIH II VIL VIH Vhys II referenced to CGND; IDIAGN = 1 mA referenced to CGND no error condition referenced to CGND referenced to CGND VENABLE = 12 V referenced to CGND referenced to CGND
[2]
0 0 3 0 3 -
70 0.3 70
1 12 50 1 12 140 0.5 VDDA 140
V V A V V A V V V A
Enable input: pin ENABLE
Power-up input: pin POWERUP
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Objective data sheet
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
Table 10: Static characteristics ...continued VP = 25 V; fcarrier = 384 kHz; Tamb = 25 C; unless otherwise specified. Symbol Tdiag Iprot Parameter diagnostic trigger temperature Conditions VDIAGN = VOL Min 150 7.5 Typ Max Unit C A Temperature protection Overcurrent protection diagnostic and protection trigger VDIAGN = VOL current diagnostic and protection trigger VDIAGN = VOL maximum supply voltage
Overvoltage protection VDD(max) 30 33 V
[1] [2]
When the supply voltage is below 12.5 V the PWM outputs will not be able to switch to the high side at the first PWM cycle. OTP, OCP and/or OVP protection activated.
12. Dynamic characteristics
Table 11: Dynamic characteristics VP = 25 V; Tamb = 25 C; fcarrier = 384 kHz; see also Figure 8 for definitions. Symbol PWM output tr tf tdead tr(LH) rise time output voltage fall time output voltage dead time large signal response time LOW-to-HIGH transition at output large signal response time HIGH-to-LOW transition at output minimal pulse width RDS_ON output transistors efficiency Po = Prated
[1]
Parameter
Conditions
Min -
Typ 20 20 0 90
Max -
Unit ns ns ns ns
input amplitude = 3.3 V
-
tr(HL)
input amplitude = 3.3 V
-
90
-
ns
tW(min) RDS_ON
[1]
-
150 0.2 -
0.3 90
ns -
Output power measured across the loudspeaker load. Power measurement based on indirect measurement by measuring the RDS_ON.
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
input Vi(dif) 3.3 V Vcom
tr(LH) VDD
tr(HL)
tW(min)
output Vo
0V
VSS tr 1/fc time
001aaa063
tf
Vcommon = VSSA1 to (VDDA1 - 7.5 V). tdead cannot be represented in the figure. Response times depend on input signal amplitude. The second input pulse is not reproduced with same pulse width by the output due to minimum pulse width limitation.
Fig 5. Timing diagram PWM output.
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
13. Output power estimation
The maximum achievable output power is not only determined by the power comparator characteristics, but by the total system application. The following application blocks determine the maximum achievable output power: Power comparator:
* Minimum pulse width * Series resistances: RDS_ON, bond wires, printed-circuit board tracks, series resistance
of the coil, etc. System application:
* Power supply voltage * Load impedance * Controller characteristics: maximum modulation depth and carrier frequency.
In Figure 6 an estimate is given for the output power in full-bridge application as function of the (symmetrical) supply voltage for different values of the load-impedance. The following variables are taken into account:
* Minimum pulse width: 150 ns * Total series resistance: 0.4 * Carrier frequency: 384 kHz.
200 Pout (W) 160
001aaa626
250 Pout (W) 200
001aaa627
120
(1)
150
(1) (2)
(2)
80
(3)
100
(3)
40
50
0 10 14 18 22 26 VP (V) 30
0 10 14 18 22 26 VP (V) 30
(1) ZL = 4 . (2) ZL = 6 . (3) ZL = 8 .
(1) ZL = 4 . (2) ZL = 6 . (3) ZL = 8 .
Fig 6. Output power estimation as a function of (symmetrical) supply voltage for THD = 1 %.
Fig 7. Output power estimation as a function of (symmetrical) supply voltage for THD = 10 %.
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Objective data sheet Rev. 01 -- 22 April 2004
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14. Application information
Philips Semiconductors
CON1 SUPPLY 1 2
L1 BEAD VDD +50 V V+
C1 100 nF C2 1000 F (63 V) R3 10 C4 100 nF R1 10 k R2 1 k R5 R4 10 C5 100 nF
V+ V+
C3 470 F (63 V) C6 100 nF C8 220 pF C9 220 pF
VCC
C7 100 nF R6 10 (0.25 W)
VDDA1 IN1neg IN1pos 3 2
VDDA2 10
VDDP1 23
VDDP2 14 21 OUT1
L2 (1) C11(1) C10 100 nF R8 22 (1 W) C12 220 nF
OUTneg OUTpos DIGITAL PWM CONTROLLER power stage on/off
47 R7 47
4 22 5 19
BOOT1
C13 100 nF
POWERUP
R9 47 R10
STAB1
CON3 OUTPUT 1 2
ENABLE
6
TDA8939TH
DIAGN 18 7 15 8
OUTpos STAB2
C14 100 nF
OUTneg
overload
47
BOOT2
CGND
R11 47 R13 47
Zero dead time Class-D 7.5 A power comparator
IN2neg IN2pos
C15 100 nF
11
16 13
OUT2 n.c.
L3 (1) C18(1) R14 10 (0.25 W) R12 22 (1 W) C19 220 nF
9 1 12 24 20 17
VSSA1
VSSA2 VSSD
VSSP1
VSSP2
C16 220 pF V+ C17 220 pF
001aaa628
TDA8939
(1) For 8 BTL and fcorner = 40.2 kHz: L2 = L3 = 27 H; C11 = C18 = 470 nF. For 8 BTL and fcorner = 44.5 kHz: L2 = L3 = 22 H; C11 = C18 = 470 nF. For 4 BTL and fcorner = 47.7 kHz: L2 = L3 = 10 H; C11 = C18 = 1 F.
13 of 21
Fig 8. Typical application diagram using a single (asymmetrical) supply voltage.
Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
15. Test information
15.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
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Objective data sheet
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TDA8939
Zero dead time Class-D 7.5 A power comparator
16. Package outline
HSOP24: plastic, heatsink small outline package; 24 leads; low stand-off height SOT566-3
E D x
A X
c y E2 HE vM A
D1 D2 1 pin 1 index Q A2 E1 A4 Lp detail X 24 Z e bp 13 wM (A3) A 12
0
5 scale
10 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A A2 max. 3.5 3.5 3.2 A3 0.35 A4(1) bp c D(2) D1 D2 1.1 0.9 E(2) 11.1 10.9 E1 6.2 5.8 E2 2.9 2.5 e 1 HE 14.5 13.9 Lp 1.1 0.8 Q 1.7 1.5 v w x y Z 2.7 2.2 8 0
+0.08 0.53 0.32 16.0 13.0 -0.04 0.40 0.23 15.8 12.6
0.25 0.25 0.03 0.07
Notes 1. Limits per individual lead. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT566-3 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION
ISSUE DATE 03-02-18 03-07-23
Fig 9. Package outline.
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Objective data sheet
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TDA8939
Zero dead time Class-D 7.5 A power comparator
17. Soldering
17.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended.
17.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 270 C depending on solder paste material. The top-surface temperature of the packages should preferably be kept:
* below 225 C (SnPb process) or below 245 C (Pb-free process)
- for all BGA, HTSSON..T and SSOP..T packages - for packages with a thickness 2.5 mm - for packages with a thickness < 2.5 mm and a volume 350 mm3 so called thick/large packages.
* below 240 C (SnPb process) or below 260 C (Pb-free process) for packages with a
thickness < 2.5 mm and a volume < 350 mm3 so called small/thin packages. Moisture sensitivity precautions, as indicated on packing, must be respected at all times.
17.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:
* Use a double-wave soldering method comprising a turbulent wave with high upward
pressure followed by a smooth laminar wave.
* For packages with leads on two sides and a pitch (e):
- larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board;
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Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
- smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
* For packages with leads on four sides, the footprint must be placed at a 45 angle to
the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.
17.4 Manual soldering
Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
17.5 Package related soldering information
Table 12: Package [1] BGA, HTSSON..T [3], LBGA, LFBGA, SQFP, SSOP..T [3], TFBGA, USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, HVSON, SMS PLCC [5], SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO, VSSOP CWQCCN..L [8], PMFP [9], WQCCN..L [8]
[1] [2]
Suitability of surface mount IC packages for wave and reflow soldering methods Soldering method Wave not suitable not suitable [4] Reflow [2] suitable suitable
suitable not not recommended [5] [6] recommended [7]
suitable suitable suitable not suitable
not suitable
For more detailed information on the BGA packages refer to the (LF)BGA Application Note (AN01026); order a copy from your Philips Semiconductors sales office. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature exceeding 217 C 10 C measured in the atmosphere of the reflow oven. The package body peak temperature must be kept as low as possible.
[3]
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Objective data sheet
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TDA8939
Zero dead time Class-D 7.5 A power comparator
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, the solder might be deposited on the heatsink surface. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar soldering process. The appropriate soldering profile can be provided on request. Hot bar soldering or manual soldering is suitable for PMFP packages.
[5] [6] [7] [8]
[9]
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Objective data sheet
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TDA8939
Zero dead time Class-D 7.5 A power comparator
18. Revision history
Table 13: Revision history Release date 20040422 Data sheet status Objective data sheet Change notice Order number 9397 750 13023 Supersedes Document ID TDA8939_1
9397 750 13023
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Objective data sheet
Rev. 01 -- 22 April 2004
19 of 21
Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
19. Data sheet status
Level I II Data sheet status [1] Objective data Preliminary data Product status [2] [3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
20. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
21. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
22. Contact information
For additional information, please visit: http://www.semiconductors.philips.com For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 13023
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Objective data sheet
Rev. 01 -- 22 April 2004
20 of 21
Philips Semiconductors
TDA8939
Zero dead time Class-D 7.5 A power comparator
23. Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.3 8.3.1 8.3.2 8.3.3 8.4 9 10 11 12 13 14 15 15.1 16 17 17.1 17.2 17.3 17.4 17.5 18 19 20 21 22 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 5 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Interfacing between controller and the TDA8939 . 6 Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Reference voltages . . . . . . . . . . . . . . . . . . . . . . 7 Start-up timing . . . . . . . . . . . . . . . . . . . . . . . . . 7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 8 Static characteristics. . . . . . . . . . . . . . . . . . . . . 9 Dynamic characteristics . . . . . . . . . . . . . . . . . 10 Output power estimation. . . . . . . . . . . . . . . . . 12 Application information. . . . . . . . . . . . . . . . . . 13 Test information . . . . . . . . . . . . . . . . . . . . . . . . 14 Quality information . . . . . . . . . . . . . . . . . . . . . 14 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 15 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Introduction to soldering surface mount packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 16 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 16 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 17 Package related soldering information . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information . . . . . . . . . . . . . . . . . . . . 20
(c) Koninklijke Philips Electronics N.V. 2004
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 22 April 2004 Document order number: 9397 750 13023
Published in The Netherlands

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